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Home>Tools>Solder Repair>BGA Reballing Stencil >3D Black BGA Reballing Stencil kit for iPhone 8P/8/7P/7/6SP/6S/6P/6/5S/5 Communication Baseband Module Tin Planting Plate
3D Black BGA Reballing Stencil kit for iPhone 8P/8/7P/7/6SP/6S/6P/6/5S/5 Communication Baseband Module Tin Planting Plate

3D Black BGA Reballing Stencil kit for iPhone 8P/8/7P/7/6SP/6S/6P/6/5S/5 Communication Baseband Module Tin Planting PlateItem NO.: 4000258598396

US$ 8.45
Color:
5 5S
US$ 8.45
- +
6S 6SP
US$ 8.45
- +
6 6P
US$ 8.45
- +
7 7P
US$ 8.45
- +
8 8P
US$ 8.45
- +
5Pcs 1 Set
US$ 36.99
- +
Quantity: 0 , Subtotal 0
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3D Black BGA Reballing Stencil kit for iPhone 8P/8/7P/7/6SP/6S/6P/6/5S/5 Communication Baseband Module Tin Planting Plate
color:red,size:xxl
Subtotal: US$ 0
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    • Product Name: 3D Black BGA Reballing Stencil kit for iPhone 8P/8/7P/7/6SP/6S/6P/6/5S/5 Communication Baseband Module Tin Planting Plate
    • Item NO.: 4000258598396
    • Weight: 0.12 kg = 0.2646 lb = 4.2329 oz
    • Category: Tools > Solder Repair > BGA Reballing Stencil
    • Brand: Kaisi
    • Creation Time: 2020-01-04

    3D Black Steel BGA Reballing Stencil kit for iPhone 8P/8/7P/7/6SP/6S/6P/6/5S/5 Communication Baseband Module Tin Planting Plate

    --High Quality stainless steel plate board. --Specially Designed for iPhone 5/5S/6/6P/6S/6SP/7/7P/8/8P Communication Base Band Module --Make your repair work easier. --Color : Black --Feature : Square Hole --We promised all the plate boards are in Brand New condition,but this item is easy to get scratched. --There may be some scratches and fingerprint on the surface,please make sure you do not care,thanks. Package: 1* 3D BGA Reballing Stencil