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Home>Repair Tools>Tools Brand>MaAnt >New MaAnt SL-1 SL-2 Deicing by Magic Furnace For Mobile Phone PCB Motherboard Chip CPU Repair Removal Table AS Amaoe
New MaAnt SL-1 SL-2 Deicing by Magic Furnace For Mobile Phone PCB Motherboard Chip  CPU Repair Removal Table AS Amaoe

New MaAnt SL-1 SL-2 Deicing by Magic Furnace For Mobile Phone PCB Motherboard Chip CPU Repair Removal Table AS AmaoeItem NO.: SR-2477

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New MaAnt SL-1 SL-2 Deicing by Magic Furnace For Mobile Phone PCB Motherboard Chip CPU Repair Removal Table AS Amaoe
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  • New MaAnt SL-1 SL-2 Deicing by Magic Furnace For Mobile Phone PCB Motherboard Chip CPU Repair Removal Table AS Amaoe
    • Product Name: New MaAnt SL-1 SL-2 Deicing by Magic Furnace For Mobile Phone PCB Motherboard Chip CPU Repair Removal Table AS Amaoe
    • Item NO.: SR-2477
    • Weight: 0.1 kg = 0.2205 lb = 3.5274 oz
    • Category: Repair Tools > Tools Brand > MaAnt
    • Creation Time: 2024-06-03
    New MaAnt SL-1 SL-2 Deicing by Magic Furnace For Mobile Phone PCB Motherboard Chip  CPU Repair Removal Table AS Amaoe

    6 Great advantage
    Can see
    Air-free gun heating
    Non-absorbingtin tape
    No solderingiron heating

    100 degrees cooler than the wind gun Soraping is sater

    Use a cotton swab to clean up Residual tin does not damage pad paint

    No need far repeated scraping with soldering iron No dammage to the pad

    Low voltage heating board
    Non-traditlonal high pressure heating. no leakage Electrostatlcgeneratlon is safer

    Curve warming
    Built-in professional training curve ,none Need to worry about thermal by the coreChip damage

    All ft design
    No nead to worry about the bottom of the chipemptying fesulting in chip stress caused deformation and demage

    160°C~250C
    CONSTANT TEMPERATURE HEATING REMOVES GLUEAND TIN
    When heating,the temperature can be adjusted between 160 and 250 Effectively avoid due to high temperature orimproper training Burn-out chip

    Widely used

    Compatible with chips below 20mm x18.5mm
    Applies to 99% of the chipson the market
    20mm x 18.5mm working area, supports multiple generations Pingguo mobile phone chip, Huawei mobile phone chip universalhard disk and CPU Glue detinning

    160°C~250C

    CONSTANT TEMPERATURE HEATING REMOVES GLUEAND TIN
    When heating,the temperature can be adjusted between 160 and 250 Effectively avoid due to high temperature orimproper training Burn-out chip

    Easy tin removal

    After opening the glue removal table and heating to the set temperature, you can use Msterxu Brush or cotton ball and cotton swab to remove residualtin, no tin line, a wipe Can easily remove tin and glue, easy and quick tinplanting

    Air-free gun heating No soldering iron heating

    Air gun heating is safer than 100 degrees lower than air gun temperature scraping
    No soldering iron heating without repeatedscraping of soldering iron, no damage to the pad

    NON-ABSORBING TINTAPE

    After heating to a set temperature, use a cotton swab Can handle clean residual tin without damage to pad paint Non-absorbent tin brings back the wipe that wearsthe chip for a long time

    LOW VOLTAGEHEATING BOARD

    Non-traditional 220v high pressure heating

    Fast heating, no leakage, no static electricity, safer Curve heating, built-in professional adjustment curve,noneed to worry Chip damage caused by thermal stress

    TemperatureadjustableTemperatureadjustable

    160C~250C
    According to the needs ofthe job Set the temperaturead justment to you The required temperature one click Heat upquickly, no need to worry abouttemperature Overdamage chip

    Flexible hidden screw

    Hidden screw,flexible and light,flexible telescopic clamping At the same time, the hidden screw prevents the residue from falling into the screw,and moreDurable and useful

    Product information parameter

    brand:
    MA ANT
    name: The rubber removal tiable of the magic furnce
    Model number:SL-1
    temperature: 160C~250C
    epply: Aoplicable to 99% chips on the market. all kinds of
    common Pingguo, Huowoi, CPU gluo removal
    Net weight:65g
    Gross weight: 75g
    Product sice: 70*60*1 7mm
    Package size: 77*78*20mm

    PRODUCT PACKAGING INFORM ATION

    Net weight: 65g
    Gross weight; 75g
    Product size: 70*60*17mm Package size: 77*78*20mm

    MaAnt glue removal,Magic furnace to remove glue,MaAnt SL-1,Gumming table,
    CONSTANTTEMPERA,TURE HEATING Gumming table,Deicing by Magic Furnace,glue removal tool,phone glue removal tool,iphone battery glue removal tool,mechanical glue removal tool,
    Fixed Glue Removal Tools|,glue removal table,
    rubber removal table,The rubber removal tiable of the magic furnce