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Home>Tools>Solder repair>BGA Reballing Stencil >QianLi ToolPlus For iPhone A7 IC eMMC and LPDDR chip Rework Reballing Stencil
QianLi ToolPlus For iPhone A7 IC eMMC and LPDDR chip Rework Reballing Stencil

QianLi ToolPlus For iPhone A7 IC eMMC and LPDDR chip Rework Reballing Stencil Item NO.: 1430054

US$ 4.50
Type
3D 2D
Quantity

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Product Detail
Product Name QianLi ToolPlus For iPhone A7 IC eMMC and LPDDR chip Rework Reballing Stencil
Item NO. 1430054
Weight 0.5 kg = 1.1023 lb = 17.6370 oz
Category Tools > Solder repair > BGA Reballing Stencil
Brand QianLI
Creation Time 2019-05-08

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