Welcome to Sriparts
USD
Home>Tools>Solder repair>BGA Reballing Stencil >QianLi ToolPlus For iPhone A8 IC eMMC and LPDDR chip Rework Reballing Stencil
QianLi ToolPlus For iPhone A8 IC eMMC and LPDDR chip Rework Reballing Stencil

QianLi ToolPlus For iPhone A8 IC eMMC and LPDDR chip Rework Reballing Stencil Item NO.: 1430056

US$ 4.50
Type
3D 2D
Quantity

Copy and share this link on social network or send it to your friends

Copy
  • Product Description
  • The 3D feature of the Qianli Toolplus stencil makes fixing your chip much easier and 100% accurate. Enabling you to work faster and perform a perfectly precise job every time you reball a chip using this stencil, Supports eMMC BGA chips.
Product Detail
Product Name QianLi ToolPlus For iPhone A8 IC eMMC and LPDDR chip Rework Reballing Stencil
Item NO. 1430056
Weight 0.5 kg = 1.1023 lb = 17.6370 oz
Category Tools > Solder repair > BGA Reballing Stencil
Brand QianLI
Creation Time 2019-05-08

No related record found